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Taping Detaping Mounting Curing
- A tape remover for wafers of 300mm (optionally available: 8inches)
- Single and double cassette loading
- All parameters important for de-taping can be controlled in the recipe.
- Longer-lasting UV lamp realized by US’s proprietary UV technology
- can be used with ultra-thin wafers.
- other optional features are available.
- Power AC200 – 240V, Single Phase Power Consumption 2KVA [Without UV] 3KVA[With UV]
- Clean Air Pressure (CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min ) Vacuum 650 – 750mmHg
- (Min Flow Rate:60NL/min )
- Nitrogen (For UV) 0.2-0.4 Mpa ( Min Flow Rate:20NL/min )
- Exhaust Duct Capacity 1.0m3/min, lOmmH20 (100mm diameter SUS Flange duct connection)
- System Arrangement Dimension (WxDxHmm) 1350 x 1750 x 1900 Net Weight Appx 800Kg
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