By GNP
Supplier InfoProduct Type:
Equipment
Application:
CMP
Product Description:
The POLI-762 is Our Most Advanced and Intelligent CMP designed for High Versatility for 12″(300mm) CMP Process Development, Materials Evaluation and Pre-Production Runs. The POLI-762 was also designed for Advanced Wafer Manufactures and Consumables Suppliers.
Specifications
- Head, Table 30 ~ 200rpm, Rotational motion, Head oscillation(± 12㎜)
- Size 1,580W 1,480D 1,960H㎜
- Platen size Ø762㎜, (30inch), Teflon coated Aluminum
- Pressing method Variable air pressure electronic controller
- Membrane Type : 70 ~ 350g/㎠(1psi ~ 5psi)
- Wafer Down Force & Conditioning Load Monitoring System
- Process Automatic sequence, Dry- in / Wet – out
Features
- Workpiece : Max 12 inch wafer
- CMP Process : Si CMP, Oxide CMP(BPSG, TEOS, SC), Metal CMP(W, Cu), STI etc
Options
- Conditioning : Oscillating Head Type or Swing Arm Type
- Double Head System
- Friction Force & Temperature Monitoring System
Characteristics
- 300mm CMP Machine for R&D
- Stable Repeatablilty (WTWNU<5%)
- High Rigidity
- Wide Application for CMP R&D
file_downloadBrochure-POLI762.pdf
- Workpiece Max 12inch wafer
- CMP Process Si CMP, Oxide CMP(BPSG, TEOS, ThOx), Metal CMP(W, Cu), STI, etc.