Product Type:
Equipment
Application:
Taping Detaping Mounting Curing
Product Description:
DXR2 Vollautomatischer 200mm Bandentferner
Laserschneiden mit Heizwalze und Tisch
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- Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.