Product Type:
Equipment
Application:
Wet Process
Product Description:
Manual PVA brush based single wafer cleaning equipment:
- able to process 3/4/6/8/12 inch wafers
- wafer chucked by pin chuck or vacuum chuck
- DIW based cleaning
- spot ultrasonic wave
- PVA brush
- up to 2000rpm
- N2 blow
- Clean Air blow
- class 100
- washing time about 2min
- Drying time about 10s
file_downloadNDS-Auxiliary-Equipment.pdf
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