Product Type:
Parts & Consumables
Application:
Grinding
Product Description:
SiC Grinding Wheels, fine or coarse
- Vitrified bond
- Pores bond type / High Grinding performance is realized
- Bond Hardness can be adjusted
- Super high speed processing for hard to cut materials is realized
Sapphire Grinding Wheels, fine or coarse
- high self sharpening, non-dressing
- able to grind the wafers at very high speed feed rate
- lower grinding ratio
- customization possible
Contact us for more information on our consumables for grinding
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Wafer Thinning of SiC or Sapphire for IC or LED Makers
Thinning of SiC or spphire Wafers for wafer makers