R&D CMP POLI 400

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By GNP

Supplier Info

Product Type:

Equipment


Application:

CMP


Product Description:

The GnP POLI-400L is designed for Advanced CMP Process Development Applications such as MEMS, as well as CMP Characteristics Study. This System has Low Cost of Ownership and Small Footprint.


  • Head, Table 30 ~ 200 rpm, Rotational motion, Head oscillation(± 12㎜)
  • Size 700W 800D 1,200H㎜(POLI – 400), 970W 1,010D 1,850H㎜(POLI- 400L)
  • Platen size Ø406㎜(16inch), Anodized Aluminum(Option : Teflon Coated)
  • Pressing method Variable air pressure electronic controller
  • Carrier Type : 70 ~ 500g/㎠(1psi ~ 7.1psi) for 4” wafer
  • Membrane Type : 70 ~ 500g/㎠(1psi ~ 7.1psi) for 4”, 6” wafer
  • Process Automatic sequence, Dry-in / Wet-out
Features
  • Workpiece : Max 6 inch wafer, MEMS Structure, Coupon Wafer
  • CMP Process : Si CMP, Oxide CMP(BPSG, TEOS, SC), Metal CMP(W, Cu), STI, PGI etc
Options
  • Conditioning : Oscillating Head Type or Swing Arm Type
  • Double Head System
  • Friction Force & Temperature Monitoring System
  • Characteristics
  • Stable Repeatablilty (WTWNU<5%)
  • High Rigidity
  • Simple, Robust and Low Cost of Ownership

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  • Workpiece Max 6 inch wafer, MEMS structure, Coupon wafer
  • CMP Process  Si CMP, Oxide CMP(BPSG,TEOS,ThOx), Metal CMP(W, Cu), STI, etc.


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